Our unique HyperFIB tools, utilizing plasma FIB technology for maximum beam currents and fastest material removal rates, offer unparalleled means to analyze your device or material.
Delayer a complete integrated circuit – yes, the entire die. Full die delayering can help you answer critical questions relating to device design, piracy, counterfeiting, IP and patent infringement, and electrical failure analysis.
We offer the unmatched ability to analyze device structures and layout by cleanly removing layers with multiple materials across an entire die, and provide high resolution images of your device.
Cross-section BGA solder balls, MEMS printheads, gold wires, stacked die and even printed circuit boards to uncover critical features and explore failure mechanisms. Machine unique features of centimeter size or larger, 300X faster than a Ga FIB, 20X more precise than a laser.
HyperFIB also exhibits the unique ability to shape and smooth surfaces over large and small areas. As a micromachining tool, HyperFIB is scanned over the sample surface using the patterning capability of modern FIB systems.
Additionally, our HyperFIB and unique scanning methods can remove surface roughness after just a few minutes of beam exposure. This capability is very useful for generating a smooth surface for optical components and for cleanly delayering integrated circuit devices.
In this example we use the high current available with HyperFIB to quickly refurbish worn probe tips used for electrical test. In <2 minutes per tip, HyperFIB is able to clean, re-shape and re-size these tips and put a non-functional probe card back to work.
Have a unique micro-machining application? Contact us today so we may show you the power of HyperFIB technology.