HyperFIB Services

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SKU: HFIB-SERVICES Category:

Our unique HyperFIB tools, utilizing plasma FIB technology for maximum beam currents and fastest material removal rates, offer unparalleled means to analyze your device or material.

Full die delayering with HyperFIB

Full die delayering with HyperFIB

Delayer a complete integrated circuit – yes, the entire die.  Full die delayering can help you answer critical questions relating to device design, piracy, counterfeiting, IP and patent infringement, and electrical failure analysis.

We offer the unmatched ability to analyze device structures and layout by cleanly removing layers with multiple materials across an entire die, and provide high resolution images of your device.

Cross-section BGA solder balls, MEMS printheads, gold wires, stacked die and even printed circuit boards to uncover critical features and explore failure mechanisms.  Machine unique features of centimeter size or larger, 300X faster than a Ga FIB, 20X more precise than a laser.

Failing Au wire bond


Failing Au wire bond

Cross-sectioned Au wire bond

Wire bond sectioned and imaged with HyperFIB revealing contact void.
Total time to image < 1 hour

HyperFIB also exhibits the unique ability to shape and smooth surfaces over large and small areas.  As a micromachining tool, HyperFIB is scanned over the sample surface using the patterning capability of modern FIB systems.

Intel i3 device surface after HyperFIB polishing

AFM image of device surface after HyperFIB polishing.  Surface roughness has been reduced to <30nm p-p.

Intel i3 device surface as received, follows chemo-mechanical polishing step

AFM image of device surface as received, follows chemo-mechanical polishing step.  Surface roughness is ~130nm p-p.

Additionally, our HyperFIB and unique scanning methods can remove surface roughness after just a few minutes of beam exposure.  This capability is very useful for generating a smooth surface for optical components and for cleanly delayering integrated circuit devices.

 

 

 

Electrical test probe tips refurbished with HyperFIB

Electrical test probe tips refurbished with HyperFIB

In this example we use the high current available with HyperFIB to quickly refurbish worn probe tips used for electrical test. In <2 minutes per tip, HyperFIB is able to clean, re-shape and re-size these tips and put a non-functional probe card back to work.

Have a unique micro-machining application?  Contact us today so we may show you the power of HyperFIB technology.